Electroplating on Wood
نویسندگان
چکیده
منابع مشابه
Seedless electroplating on patterned silicon
Nickel thin films have been electrodeposited without the use of an additional seed layer, on highly doped silicon wafers. These substrates conduct sufficiently well to allow deposition using a peripherical electrical contact on the wafer. Films 2 μm thick have been deposited using a nickel sulfamate bath on both n+and p+-type silicon wafers, where a series of trenches with different widths had ...
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ژورنال
عنوان ژورنال: Scientific American
سال: 1898
ISSN: 0036-8733
DOI: 10.1038/scientificamerican10221898-19084asupp